Sony hcd-101 service manual

Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure. Notes on chip component replacement. Flexible Circuit Board Repairing. Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. This caution label is located inside the unit. The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc.

During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block.

Therefore, when checking the laser diode emission, ob- serve from more than 30 cm away from the objective lens. CD Door CD Mechanism Deck Front Panel and Main Board CD Tray CD Decoder Board Base Unit Circuit Boards Location Brock Diagrams. IC Brock Diagrams Printed Wiring Board —Main Section — Schematic Diagram — Main Section — Schematic Diagram —Panel Section — Printed Wiring Board —Panel Section — Compact disc digital audio system. Semiconductor laser. Continuous RMS power output.

Rated RMS power output. Reference RMS power output. The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts.

The flexible board is easily damaged and should be handled with care. The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. Notes on chip component replacement.